Adhesion behavior of CuCr alloy/polyimide films under 350°C and 85° C /85 % RH environments*

Author: Ahn E.C.   Jin Yu   Park I.S.   Lee W.J.  

Publisher: Taylor & Francis Ltd

ISSN: 1568-5616

Source: Journal of Adhesion Science and Technology, Vol.10, Iss.12, 1996-01, pp. : 1343-1357

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Abstract