Author: Chung Tae-Gyeong
Publisher: Taylor & Francis Ltd
ISSN: 1568-5616
Source: Journal of Adhesion Science and Technology, Vol.8, Iss.1, 1994-01, pp. : 41-51
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
Copper/ polyimide interaction: A local spin density study
By Ouhlal A.
Journal of Adhesion Science and Technology, Vol. 9, Iss. 7, 1995-01 ,pp. :
Evaluation of polyimide films as adhesives
Journal of Adhesion Science and Technology, Vol. 1, Iss. 1, 1987-01 ,pp. :
Hydrothermal stability of Cr/polyimide interfaces
By Kim D.G.
Journal of Adhesion Science and Technology, Vol. 5, Iss. 7, 1991-01 ,pp. :