Adhesion Enhancement of Electroplated Cu/Electroless Ni Composite Layer to (PMDA-ODA)-Type Polyimide Films

Author: Lee Hong-Kee   Son Seong-Ho   Lee Ho-Young   Koo Seok-Bon  

Publisher: Taylor & Francis Ltd

ISSN: 1568-5616

Source: Journal of Adhesion Science and Technology, Vol.22, Iss.1, 2008-01, pp. : 47-64

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Abstract