Improved adhesion between plasma-treated polyimide film and evaporated copper

By Inagaki N.   Tasaka S.   Hibi K.  

Journal of Adhesion Science and Technology, Vol. 8, Iss. 4, 1994-01 ,pp. : 395-410

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Adhesion and interface studies between copper and polyimide

By Kim Y.-H.   Walker G.F.   Kim J.   Park J.  

Journal of Adhesion Science and Technology, Vol. 1, Iss. 1, 1987-01 ,pp. : 331-339

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Adhesion improvement of electroless copper to a polyimide film substrate by combining surface microroughening and imide ring cleavage

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Plasma surface modification of polyimide for improving adhesion to electroless copper coatings

By Rozovskis G.   Vinkevičius J.   Jačiauskiene J.  

Journal of Adhesion Science and Technology, Vol. 10, Iss. 5, 1996-01 ,pp. : 399-406

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Oxygen plasma modification of polyimide webs: effect of ion bombardment on metal adhesion

By Egitto F.D.   Matienzo L.J.   Blackwell K.J.   Knoll A.R.  

Journal of Adhesion Science and Technology, Vol. 8, Iss. 4, 1994-01 ,pp. : 411-433

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