Influence of fabrication parameters on bond strength of adhesively bonded flip-chip interconnects

Author： Sinha K.   Farley D.   Kahnert T.   Solares S.D.   Dasgupta A.   Caers J.F.J.   Zhao X.J.  

Publisher： Taylor & Francis Ltd

ISSN： 1568-5616

Source： Journal of Adhesion Science and Technology, Vol.28, Iss.12, 2014-06, pp. : 1167-1191

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