Mechanics of Adhesively Bonded Flip-Chip-on-Flex Assemblies. Part II: Effect of Bump Coplanarity on Manufacturability and Durability of Non-Conducting Adhesive Assemblies

By Farley D.  

Journal of Adhesion Science and Technology, Vol. 22, Iss. 14, 2008-09 ,pp. : 1757-1780

Taylor & Francis Ltd

Access to resources Recommend Favorite

Influence of fabrication parameters on bond strength of adhesively bonded flip-chip interconnects

By Sinha K.   Farley D.   Kahnert T.   Solares S.D.   Dasgupta A.   Caers J.F.J.   Zhao X.J.  

Journal of Adhesion Science and Technology, Vol. 28, Iss. 12, 2014-06 ,pp. : 1167-1191

Taylor & Francis Ltd

Access to resources Recommend Favorite

Anisotropic Conductive Adhesives for Flip-Chip Interconnects

By Wang Weiqiang   Chan Y. C.   Pecht Michael  

Journal of Adhesion Science and Technology, Vol. 22, Iss. 8-9, 2008-06 ,pp. : 871-892

Taylor & Francis Ltd

Access to resources Recommend Favorite

Microwave Performance of Flip Chip Interconnects With Anisotropic and Non-conductive Films

By Kim Jong-Woong  

Journal of Adhesion Science and Technology, Vol. 22, Iss. 13, 2008-09 ,pp. : 1339-1354

Taylor & Francis Ltd

Access to resources Recommend Favorite

Experimental Investigation and Micropolar Modelling of the Anisotropic Conductive Adhesive Flip-Chip Interconnection

By Zhang Yan  

Journal of Adhesion Science and Technology, Vol. 22, Iss. 14, 2008-09 ,pp. : 1717-1731

Taylor & Francis Ltd

Access to resources Recommend Favorite