Mechanics of Adhesively Bonded Flip-Chip-on-Flex Assemblies. Part II: Effect of Bump Coplanarity on Manufacturability and Durability of Non-Conducting Adhesive Assemblies
Author： Farley D.
Publisher： Taylor & Francis Ltd
ISSN： 1568-5616
Source： Journal of Adhesion Science and Technology, Vol.22, Iss.14, 2008-09, pp. : 1757-1780
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