Usefulness of surfactants in reducing particle adhesion and their effectiveness in cleaning silicon wafers

By Veeramasuneni S.   Free M.L.   Miller J.D.  

Journal of Adhesion Science and Technology, Vol. 12, Iss. 2, 1998-01 ,pp. : 185-195

Taylor & Francis Ltd

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Post-chemical mechanical polishing cleaning of silicon wafers with laser-induced plasma

By Devarapalli Vamsi Krishna   Li Ying   Cetinkaya Cetin  

Journal of Adhesion Science and Technology, Vol. 18, Iss. 7, 2004-07 ,pp. : 779-794

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Numerical Simulation of Laser Shock Cleaning Process for Micro-Scale Particle Removal

By Oh Bukuk  

Journal of Adhesion Science and Technology, Vol. 22, Iss. 5-6, 2008-06 ,pp. : 635-650

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Selective removal of 10–40-nm particles from silicon wafers using laser-induced plasma shockwaves

By Peri M. D. Murthy   Devarapalli Vamsi K.   Cetinkaya Cetin  

Journal of Adhesion Science and Technology, Vol. 21, Iss. 3-4, 2007-04 ,pp. : 331-337

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Non-contact removal of 60-nm latex particles from silicon wafers with laser-induced plasma

By Varghese Ivin   Cetinkaya Cetin  

Journal of Adhesion Science and Technology, Vol. 18, Iss. 7, 2004-07 ,pp. : 795-806

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