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Journal of Adhesion Science and Technology, Vol. 14, Iss. 9, 2000-05 ,pp. : 1119-1130

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Improvement in the adhesion between copper metal and polyimide substrate by plasma polymer deposition of cyano compounds onto polyimide

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Journal of Adhesion Science and Technology, Vol. 10, Iss. 3, 1996-01 ,pp. : 243-256

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Adhesion improvement of electroless copper to a polyimide film substrate by combining surface microroughening and imide ring cleavage

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XPS study of the PET film surface modified by CO2 plasma: effects of the plasma parameters and ageing

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Journal of Adhesion Science and Technology, Vol. 11, Iss. 5, 1997-01 ,pp. : 735-751

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Plasma surface modification of poly(m-aramide) fabric for adhesion improvement to fluorosilicone rubber

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