Author: Lau John H Chang Chris Chen Tony Cheng David Lao Eric
Publisher: Emerald Group Publishing Ltd
ISSN: 0305-6120
Source: Circuit World, Vol.24, Iss.3, 1998-03, pp. : 11-25
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
A low-cost chip size package ‐ NuCSP
Circuit World, Vol. 24, Iss. 1, 1998-01 ,pp. :
Low Cost Solder Bumped Flip Chip MCM-L Demonstration
Circuit World, Vol. 21, Iss. 4, 1993-12 ,pp. :
Design of a Low-cost Wire Bond Tape Ball Grid Array Package*
Circuit World, Vol. 22, Iss. 3, 1996-03 ,pp. :