Design and Procurement of Eutectic Sn/Pb Solder-bumped Flip Chip Test Die and Organic Substrates

Author: Lau J.   Heydinger M.   Glazer J.   Uno D.  

Publisher: Emerald Group Publishing Ltd

ISSN: 0305-6120

Source: Circuit World, Vol.21, Iss.3, 1993-12, pp. : 20-24

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Abstract