High Strength, Low Profile Copper Foil for High Performance PCBs

Author: Chiang S.K.   DiFranco D.F.   Pucci D.G.  

Publisher: Emerald Group Publishing Ltd

ISSN: 0305-6120

Source: Circuit World, Vol.21, Iss.3, 1993-12, pp. : 56-59

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract