Challenges in the manufacture of glass substrates for electrical and optical interconnect

Author: Hutt David A.   Williams Karen   Conway Paul P.   Khoshnaw Fuad M.   Cui Xiaoyun   Bhatt Deepa  

Publisher: Emerald Group Publishing Ltd

ISSN: 0305-6120

Source: Circuit World, Vol.33, Iss.1, 2007-02, pp. : 22-30

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