Research Summary: Sn-Ag-Cu Solders and Solder Joints: Alloy Development, Microstructure, and Properties

Author： Anderson I.E.   Cook B.A.   Harringa J.L.   Terpstra R.L.  

Publisher： Springer Publishing Company

ISSN： 1543-1851

Source： JOM, Vol.54, Iss.6, 2002-06, pp. : 26-29

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