The effect of PECVD SiN moisture barrier layers on the degradation of a flip chip underfill material

Author： Kaltenpoth G.   Siebert W.   Xie X-M.   Stubhan F.  

Publisher： Emerald Group Publishing Ltd

ISSN： 0954-0911

Source： Soldering & Surface Mount Technology, Vol.13, Iss.3, 2001-12, pp. : 12-15

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