Period of time: 2015年3期
Publisher: Emerald Group Publishing Ltd
Founded in: 1981
Total resources: 58
ISSN: 0954-0911
Subject: TF Metallurgical Industry
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Soldering & Surface Mount Technology,volume 13,issue 3
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Ceramic chip scale package solder joint reliability
By Seyyedi J.,Padgett J. in (2001)
Soldering & Surface Mount Technology,volume 13,issue 3 , Vol. 13, Iss. 3, 2001-12 , pp.The effect of PECVD SiN moisture barrier layers on the degradation of a flip chip underfill material
By Kaltenpoth G.,Siebert W.,Xie X-M.,Stubhan F. in (2001)
Soldering & Surface Mount Technology,volume 13,issue 3 , Vol. 13, Iss. 3, 2001-12 , pp.Microstructure investigation of Sn-0.5Cu-3.5Ag and Sn-3.5Ag-0.5Cu-0.5B lead-free solders
By Ye L.,Lai Z.H.,Liu J.,Thölén A. in (2001)
Soldering & Surface Mount Technology,volume 13,issue 3 , Vol. 13, Iss. 3, 2001-12 , pp.Lead-free reflow soldering for electronics assembly
By Harrison M.R.,Vincent J.H.,Steen H.A.H. in (2001)
Soldering & Surface Mount Technology,volume 13,issue 3 , Vol. 13, Iss. 3, 2001-12 , pp.