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Soldering & Surface Mount Technology, Vol. 19, Iss. 1, 2007-02 ,pp. : 28-33

Emerald Group Publishing Ltd

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Improving the reliability of a plastic IC package in the reflow soldering process by DOE

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Soldering & Surface Mount Technology, Vol. 17, Iss. 1, 2005-01 ,pp. : 40-48

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The application of IR thermography to process monitoring and control of reflow soldering

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Soldering & Surface Mount Technology, Vol. 10, Iss. 1, 1998-01 ,pp. : 13-18

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Finite element analysis of flip?–?chip on board (FCOB) assembly during reflow soldering process

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Soldering & Surface Mount Technology, Vol. 24, Iss. 2, 2012-04 ,pp. : 92-99

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Computational fluid dynamic and thermal analysis for BGA assembly during forced convection reflow soldering process

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Soldering & Surface Mount Technology, Vol. 24, Iss. 2, 2012-04 ,pp. : 77-91

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