Computational fluid dynamic and thermal analysis for BGA assembly during forced convection reflow soldering process

Author: Lau Chun-Sean   Abdullah M.Z.   Ani F. Che  

Publisher: Emerald Group Publishing Ltd

ISSN: 0954-0911

Source: Soldering & Surface Mount Technology, Vol.24, Iss.2, 2012-04, pp. : 77-91

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract