Comparison of solder ball shear strengths for various nickel platings on the bond pads of a PBGA substrate

By Yan Eric C.C.   Lee S.W. Ricky   Huang X.  

Soldering & Surface Mount Technology, Vol. 16, Iss. 2, 2004-08 ,pp. : 21-26

Emerald Group Publishing Ltd

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PBGA solder ball coplanarity impact evaluation

By Huang Tony   Chu Joe  

Soldering & Surface Mount Technology, Vol. 11, Iss. 3, 1999-12 ,pp. : 40-45

Emerald Group Publishing Ltd

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Solder ball failure mechanisms in plastic ball grid array packages

By Zhong C.H.   Yi S.   Whalley D.C.  

Soldering & Surface Mount Technology, Vol. 14, Iss. 2, 2002-07 ,pp. : 40-50

Emerald Group Publishing Ltd

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Reliability testing and data analysis of lead-free solder joints for high-density packages

By Lau John   Hoo Nick   Horsley Rob   Smetana Joe   Shangguan Dongkai   Dauksher Walter   Love Dave   Menis Irv   Sullivan Bob  

Soldering & Surface Mount Technology, Vol. 16, Iss. 2, 2004-08 ,pp. : 46-68

Emerald Group Publishing Ltd

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Solder joint reliability of plastic ball grid array packages

By Zhong Chong Hua   Yi Sung  

Soldering & Surface Mount Technology, Vol. 11, Iss. 1, 1999-01 ,pp. : 44-48

Emerald Group Publishing Ltd

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