Comparison of solder ball shear strengths for various nickel platings on the bond pads of a PBGA substrate

By Yan Eric C.C.   Lee S.W. Ricky   Huang X.  

Soldering & Surface Mount Technology, Vol. 16, Iss. 2, 2004-08 ,pp. : 21-26

Emerald Group Publishing Ltd

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Effect of multiple reflow cycles on ball impact responses of Sn-Ag-Cu solder joints

By Lai Yi-Shao   Kao C.R.   Chang Hsiao-Chuan   Kao Chin-Li  

Soldering & Surface Mount Technology, Vol. 21, Iss. 3, 2009-06 ,pp. : 4-9

Emerald Group Publishing Ltd

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Assessment of board level solder joint reliability for PBGA assemblies with lead-free solders

By Lee Shi-Wei Ricky   Lui Ben Hoi Wai   Kong Y.H.   Baylon Bernard   Leung Timothy   Umali Pompeo   Agtarap Hector  

Soldering & Surface Mount Technology, Vol. 14, Iss. 3, 2002-12 ,pp. : 46-50

Emerald Group Publishing Ltd

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Interaction kinetics between PBGA solder balls and Au/Ni/Cu metallisation during laser reflow bumping

By Tian Yanhong   Wang Chunqing   Zhang Xiaodong   Liu Deming  

Soldering & Surface Mount Technology, Vol. 15, Iss. 2, 2003-06 ,pp. : 17-21

Emerald Group Publishing Ltd

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Solder ball failure mechanisms in plastic ball grid array packages

By Zhong C.H.   Yi S.   Whalley D.C.  

Soldering & Surface Mount Technology, Vol. 14, Iss. 2, 2002-07 ,pp. : 40-50

Emerald Group Publishing Ltd

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