Optimisation modelling for thermal fatigue reliability of lead-free interconnects in fine-pitch flip-chip packaging

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Soldering & Surface Mount Technology, Vol. 21, Iss. 1, 2009-02 ,pp. : 11-24

Emerald Group Publishing Ltd

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Flip chip solder joint reliability under harsh environment

By Bo Cheng   Li Wang   Qun Zhang   Xia Gao   Xiaoming Xie   Kempe Wolfgang  

Soldering & Surface Mount Technology, Vol. 15, Iss. 3, 2003-12 ,pp. : 15-20

Emerald Group Publishing Ltd

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Solder joint reliability of plastic ball grid array with solder bumped flip chip

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Soldering & Surface Mount Technology, Vol. 12, Iss. 2, 2000-02 ,pp. : 16-23

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Lead-free solder joint reliability estimation of flip chip package using FEM-based sensitivity analysis

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Soldering & Surface Mount Technology, Vol. 21, Iss. 1, 2009-02 ,pp. : 31-41

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Investigation of a solder bumping technique for flip-chip interconnection

By Hutt David A   Rhodes Daniel G   Conway Paul P   Mannan Samjid H   Whalley David C   Holmes Andrew S  

Soldering & Surface Mount Technology, Vol. 12, Iss. 1, 2000-01 ,pp. : 7-14

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