Low cycle fatigue testing and simulation of Sn-8Zn-3Bi and Sn-37Pb solder joints

By Sun Peng   Andersson Cristina   Wei Xicheng   Cao Liqiang   Cheng Zhaonian   Liu Johan  

Soldering & Surface Mount Technology, Vol. 17, Iss. 4, 2005-04 ,pp. : 38-45

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Effects of Pb contamination on the eutectic Sn-Ag solder joint

By Choi S   Bieler T.R.   Subramanian K.N.   Lucas J.P.  

Soldering & Surface Mount Technology, Vol. 13, Iss. 2, 2001-04 ,pp. : 26-29

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

The low-cycle fatigue and fatigue-crack-growth behavior of HAYNES® HR-120 alloy

By Chen L.   Liaw P.   McDaniels R.   Klarstrom D.  

Metallurgical and Materials Transactions A, Vol. 34, Iss. 7, 2003-07 ,pp. : 1451-1460

Springer Publishing Company

Access to resources Recommend Favorite

Microstructural features contributing to enhanced behaviour of Sn-Ag based solder joints

By Lee J.G.   Subramanian K.N.  

Soldering & Surface Mount Technology, Vol. 17, Iss. 1, 2005-01 ,pp. : 33-39

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Tensile Test Behavior of the Eutectic Sn-Ag Solder Joint in Ball Grid Array Assemblies

By Yeh M.S.   Chiang J.T.  

Metallurgical and Materials Transactions A, Vol. 35, Iss. 12, 2004-12 ,pp. : 3817-3821

Springer Publishing Company

Access to resources Recommend Favorite