![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
Author: Lee J.G. Subramanian K.N.
Publisher: Emerald Group Publishing Ltd
ISSN: 0954-0911
Source: Soldering & Surface Mount Technology, Vol.17, Iss.1, 2005-01, pp. : 33-39
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
The orientation imaging microscopy of lead-free Sn-Ag solder joints
JOM, Vol. 57, Iss. 6, 2005-06 ,pp. :
![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
By Zeng Guang Xue Songbai Zhang Liang Sheng Zhong Gao Lili
Soldering & Surface Mount Technology, Vol. 22, Iss. 4, 2010-09 ,pp. :