Author: Lee Chang-Chun Chang Kuo-Chin Yang Ya-Wen
Publisher: Emerald Group Publishing Ltd
ISSN: 0954-0911
Source: Soldering & Surface Mount Technology, Vol.21, Iss.1, 2009-02, pp. : 31-41
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
Ceramic chip scale package solder joint reliability
Soldering & Surface Mount Technology, Vol. 13, Iss. 3, 2001-12 ,pp. :
Thermal cycling reliability of lead-free chip resistor solder joints
By Suhling Jeffrey C. Gale H.S. Johnson R. Wayne Islam M. Nokibul Shete Tushar Lall Pradeep Bozack Michael J. Evans John L. Seto Ping Gupta Tarun Thompson James R.
Soldering & Surface Mount Technology, Vol. 16, Iss. 2, 2004-08 ,pp. :
By Huang Meng-Kuang Lee Chiapyng Wu Pei-Lin Tzan Shyh-Rong
Soldering & Surface Mount Technology, Vol. 17, Iss. 3, 2005-09 ,pp. :