Lead-free solder joint reliability estimation of flip chip package using FEM-based sensitivity analysis

Author: Lee Chang-Chun   Chang Kuo-Chin   Yang Ya-Wen  

Publisher: Emerald Group Publishing Ltd

ISSN: 0954-0911

Source: Soldering & Surface Mount Technology, Vol.21, Iss.1, 2009-02, pp. : 31-41

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract