Period of time： 2015年2期
Publisher： Emerald Group Publishing Ltd
Founded in： 1981
Total resources： 58
ISSN： 0954-0911
Subject： TF Metallurgical Industry
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Soldering & Surface Mount Technology,volume 15,issue 2
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Pb-free solder bumping for flip chip package by electroplating
By Hwang Hyeon,Hong Soon-Min,Jung Jae-Pil,Kang Choon-Sik in (2003)
Soldering & Surface Mount Technology,volume 15,issue 2 , Vol. 15, Iss. 2, 2003-06 , pp.
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