![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
Author: Dusek Milos Wickham Martin Hunt Christopher
Publisher: Emerald Group Publishing Ltd
ISSN: 0954-0911
Source: Soldering & Surface Mount Technology, Vol.17, Iss.2, 2005-06, pp. : 22-31
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
Thermal cycling reliability of lead-free chip resistor solder joints
By Suhling Jeffrey C. Gale H.S. Johnson R. Wayne Islam M. Nokibul Shete Tushar Lall Pradeep Bozack Michael J. Evans John L. Seto Ping Gupta Tarun Thompson James R.
Soldering & Surface Mount Technology, Vol. 16, Iss. 2, 2004-08 ,pp. :
![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
By Liu De-Shin Hsu Chang-Lin Kuo Chia-Yuan Huang Ya-Ling Lin Kwang-Lung Shen Geng-Shin
Soldering & Surface Mount Technology, Vol. 24, Iss. 1, 2012-02 ,pp. :
![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)