A novel high speed impact testing method for evaluating the low temperature effects of eutectic and lead-free solder joints

Author： Liu De-Shin   Hsu Chang-Lin   Kuo Chia-Yuan   Huang Ya-Ling   Lin Kwang-Lung   Shen Geng-Shin  

Publisher： Emerald Group Publishing Ltd

ISSN： 0954-0911

Source： Soldering & Surface Mount Technology, Vol.24, Iss.1, 2012-02, pp. : 22-29

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