Thermal cycling reliability of lead-free chip resistor solder joints

Author: Suhling Jeffrey C.   Gale H.S.   Johnson R. Wayne   Islam M. Nokibul   Shete Tushar   Lall Pradeep   Bozack Michael J.   Evans John L.   Seto Ping   Gupta Tarun   Thompson James R.  

Publisher: Emerald Group Publishing Ltd

ISSN: 0954-0911

Source: Soldering & Surface Mount Technology, Vol.16, Iss.2, 2004-08, pp. : 77-87

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