Minimizing flux spatter during lead-free reflow assembly

Author： Manjunath Deepak Iyer Satyanarayan Eckel Shawn Damodaran Purushothaman Srihari Krishnaswami

ISSN： 0954-0911

Source： Soldering & Surface Mount Technology, Vol.18, Iss.3, 2006-07, pp. : 19-23

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