Reduced temperature soldering of capacitors using Sn-Bi plated Sn-3.5%Ag

Author： Kim Mi Jin Zhou Y. (Norman) Jung Jae Pil

ISSN： 0954-0911

Source： Soldering & Surface Mount Technology, Vol.19, Iss.3, 2007-07, pp. : 3-8

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Active Soldering of Indium Tin Oxide (ITO) With Cu in Air Using an Sn3.5Ag4Ti(Ce, Ga) Filler

By Chang S. Y. Tsao L. C. Chiang M. J. Tung C. N. Pan G. H. Chuang T. H.

Journal of Materials Engineering and Performance, Vol. 12, Iss. 4, 2003-08 ,pp. : 383-389

Springer Publishing Company

Access to resources Recommend Favorite

Effect of SnAgCu composition on soldering performance

By Huang Benlih Dasgupta Arnab Lee Ning-Cheng

Soldering & Surface Mount Technology, Vol. 17, Iss. 3, 2005-09 ,pp. : 9-19

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Flow curves of Sn and Sn-3.5Ag obtained by rotational viscometry using a stainless steel cone

IOP Conference Series: Materials Science and Engineering, Vol. 61, Iss. 1, 2014-08 ,pp. : 145-152

IOP Publishing

Access to resources Recommend Favorite

Morphology and growth kinetics of Ag₃Sn during soldering reaction between liquid Sn and an Ag substrate

By Su T. Tsao L. Chang S. Chuang T.

Journal of Materials Engineering and Performance, Vol. 11, Iss. 4, 2002-08 ,pp. : 365-368

Springer Publishing Company

Access to resources Recommend Favorite

(Sn-Ag)_eut+Cu soldering materials, part I: Wettability studies

By Gasior W. Moser Z. Pstruś J. Bukat K. Sitek J. Kisiel R.

Journal of Phase Equilibria & Diffusion, Vol. 25, Iss. 2, 2004-04 ,pp. : 115-121

Springer Publishing Company

Access to resources Recommend Favorite