Thermal cycling reliability of lead-free chip resistor solder joints

By Suhling Jeffrey C.   Gale H.S.   Johnson R. Wayne   Islam M. Nokibul   Shete Tushar   Lall Pradeep   Bozack Michael J.   Evans John L.   Seto Ping   Gupta Tarun   Thompson James R.  

Soldering & Surface Mount Technology, Vol. 16, Iss. 2, 2004-08 ,pp. : 77-87

Emerald Group Publishing Ltd

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Reliability testing and data analysis of lead-free solder joints for high-density packages

By Lau John   Hoo Nick   Horsley Rob   Smetana Joe   Shangguan Dongkai   Dauksher Walter   Love Dave   Menis Irv   Sullivan Bob  

Soldering & Surface Mount Technology, Vol. 16, Iss. 2, 2004-08 ,pp. : 46-68

Emerald Group Publishing Ltd

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Lead-free PCB assembly and effects of process conditions on the profile and reliability of solder joints

By Zhong Z.W.   Arulvanan P   Shi X.Q.  

Soldering & Surface Mount Technology, Vol. 17, Iss. 4, 2005-04 ,pp. : 33-37

Emerald Group Publishing Ltd

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Solidification and reliability of lead-free solder interconnection

By Yu Hao   Shangguan Dongkai  

Soldering & Surface Mount Technology, Vol. 25, Iss. 1, 2013-02 ,pp. : 31-38

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Reliability of tin-lead balled BGAs soldered with lead-free solder paste

By Nurmi Sami Tapani   Ristolainen Eero Olavi  

Soldering & Surface Mount Technology, Vol. 14, Iss. 2, 2002-07 ,pp. : 35-39

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