On the factors affecting the dissolution of copper in molten lead-free solders and development of a method to assess the soldering parameters

Author： Maio D. Di   Hunt C.P.  

Publisher： Emerald Group Publishing Ltd

ISSN： 0954-0911

Source： Soldering & Surface Mount Technology, Vol.21, Iss.4, 2009-09, pp. : 24-31

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Dissolution of stainless steels in molten lead-free solders

By Takemoto Tadashi   Takemoto Masaharu  

Soldering & Surface Mount Technology, Vol. 18, Iss. 3, 2006-07 ,pp. : 24-30

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Dissolution rates of iron plating on soldering iron tips in molten lead-free solders

By Takemoto Tadashi   Uetani Takashi   Yamazaki Morio  

Soldering & Surface Mount Technology, Vol. 16, Iss. 3, 2004-12 ,pp. : 9-15

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Dissolution kinetics of copper in lead-free liquid solders

By  

Soldering & Surface Mount Technology, Vol. 27, Iss. 2, 2015-04 ,pp. : 84-89

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Developments in Lead-Free Solders and Soldering Technology

By Kang Sung K.  

JOM, Vol. 54, Iss. 6, 2002-06 ,pp. : 25-25

Springer Publishing Company

Access to resources Recommend Favorite

Development and validation of lead-free wave soldering process

By Forstén Atso   Steen Hector   Wilding Ian   Friedrich Jürgen  

Soldering & Surface Mount Technology, Vol. 12, Iss. 3, 2000-12 ,pp. : 29-34

Emerald Group Publishing Ltd

Access to resources Recommend Favorite