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Period of time: 2015年4期
Publisher: Emerald Group Publishing Ltd
Founded in: 1981
Total resources: 58
ISSN: 0954-0911
Subject: TF Metallurgical Industry
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Soldering & Surface Mount Technology,volume 21,issue 4
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Effects of conformal coating on anisotropically conductive adhesive joints; a medical perspective
By Kokko Kati,Harjunpää Hanna,Haltia Anna-Maija,Heino Pekka,Kellomäki Minna in (2009)
Soldering & Surface Mount Technology,volume 21,issue 4 , Vol. 21, Iss. 4, 2009-09 , pp.![](/images/ico/ico5.png)
By Wickham Martin,Zou Ling,Hunt Christopher in (2009)
Soldering & Surface Mount Technology,volume 21,issue 4 , Vol. 21, Iss. 4, 2009-09 , pp.![](/images/ico/ico5.png)
Improving high-temperature oxidation behaviour of Sn-Zn-Ag-Al-Ga solders
By Yeh T.K.,Lin K.L.,Salam B. in (2009)
Soldering & Surface Mount Technology,volume 21,issue 4 , Vol. 21, Iss. 4, 2009-09 , pp.![](/images/ico/ico5.png)
By Maio D. Di,Hunt C.P. in (2009)
Soldering & Surface Mount Technology,volume 21,issue 4 , Vol. 21, Iss. 4, 2009-09 , pp.![](/images/ico/ico5.png)
By Pan Jianbiao,Chou Tzu-Chien,Bath Jasbir,Willie Dennis,Toleno Brian J. in (2009)
Soldering & Surface Mount Technology,volume 21,issue 4 , Vol. 21, Iss. 4, 2009-09 , pp.![](/images/ico/ico5.png)
Reflow profile optimization of µ BGA solder joints considering reflow temperature and time coupling
By Bo Tao,Zhouping Yin,Han Ding,Yiping Wu in (2009)
Soldering & Surface Mount Technology,volume 21,issue 4 , Vol. 21, Iss. 4, 2009-09 , pp.![](/images/ico/ico5.png)
Local melt process of solder bumping by induction heating reflow
By Xu Hongbo,Li Mingyu,Fu Yonggao,Wang Ling,Kim Jongmyung in (2009)
Soldering & Surface Mount Technology,volume 21,issue 4 , Vol. 21, Iss. 4, 2009-09 , pp.