Effects of bulk Cu 6 Sn 5 intermetallic compounds on the properties of Sn-Ag-Cu-Ce soldered joints

By Zhang Liang   Xue Song-bai   Gao Li-li   Sheng Zhong   Dai Wei   Ji Feng   Ye Huan   Chen Yan   Yu Sheng-lin  

Soldering & Surface Mount Technology, Vol. 23, Iss. 1, 2011-02 ,pp. : 4-9

Emerald Group Publishing Ltd

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Reflow profile study of the Sn-Ag-Cu solder

By Salam B   Virseda C   Da H   Ekere N.N.   Durairaj R  

Soldering & Surface Mount Technology, Vol. 16, Iss. 1, 2004-02 ,pp. : 27-34

Emerald Group Publishing Ltd

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Effect of reflow profile on wetting and intermetallic formation between Sn/Ag/Cu solder components and printed circuit boards

By Arra Minna   Shangguan Dongkai   Ristolainen Eero   Lepistö Toivo  

Soldering & Surface Mount Technology, Vol. 14, Iss. 2, 2002-07 ,pp. : 18-25

Emerald Group Publishing Ltd

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Effect of multiple reflow cycles on ball impact responses of Sn-Ag-Cu solder joints

By Lai Yi-Shao   Kao C.R.   Chang Hsiao-Chuan   Kao Chin-Li  

Soldering & Surface Mount Technology, Vol. 21, Iss. 3, 2009-06 ,pp. : 4-9

Emerald Group Publishing Ltd

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Influence of Reflow and Thermal Aging on the Shear Strength and Fracture Behavior of Sn-3.5Ag Solder/Cu Joints

By Deng X.   Sidhu R.S.   Johnson P.   Chawla N.  

Metallurgical and Materials Transactions A, Vol. 36, Iss. 1, 2005-01 ,pp. : 55-64

Springer Publishing Company

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