Microelectronic packaging reliability using the RSM technique

Author: Wu Mei-Ling  

Publisher: Emerald Group Publishing Ltd

ISSN: 0954-0911

Source: Soldering & Surface Mount Technology, Vol.22, Iss.2, 2010-01, pp. : 3-12

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content