Period of time: 2015年2期
Publisher: Emerald Group Publishing Ltd
Founded in: 1981
Total resources: 58
ISSN: 0954-0911
Subject: TF Metallurgical Industry
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Soldering & Surface Mount Technology,volume 22,issue 2
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Microelectronic packaging reliability using the RSM technique
Soldering & Surface Mount Technology,volume 22,issue 2 , Vol. 22, Iss. 2, 2010-01 , pp.Effects of Zn additions on the structure of the soldered Sn-3.5Ag and Cu interfaces
By Xu R.L.,Liu Y.C.,Wei C.,Yu L.M. in (2010)
Soldering & Surface Mount Technology,volume 22,issue 2 , Vol. 22, Iss. 2, 2010-01 , pp.Thermomechanically loaded lead-free LGA joints in LTCC/PWB assemblies
By Nousiainen Olli,Urhonen Timo,Kangasvieri Tero,Rautioaho Risto,Vähäkangas Jouko in (2010)
Soldering & Surface Mount Technology,volume 22,issue 2 , Vol. 22, Iss. 2, 2010-01 , pp.By Zhang Liang,Xue Song-bai,Gao Li-li,Chen Yan,Yu Sheng-lin,Sheng Zhong,Zeng Guang in (2010)
Soldering & Surface Mount Technology,volume 22,issue 2 , Vol. 22, Iss. 2, 2010-01 , pp.Study of the effects of PCB surface finish on plasma process time for lead-free wave soldering
By Takyi G.,Ekere N.N. in (2010)
Soldering & Surface Mount Technology,volume 22,issue 2 , Vol. 22, Iss. 2, 2010-01 , pp.Thermal fatigue behaviour of Al 2 O 3 -DBC substrates under high temperature cyclic loading
By Dong Guangcheng,Chen Xu,Zhang Xinjian,Ngo Khai D.T.,Lu Guo-Quan in (2010)
Soldering & Surface Mount Technology,volume 22,issue 2 , Vol. 22, Iss. 2, 2010-01 , pp.