Influence of Cu addition on intermetallic compound formation and microstructure of Sn–3Ag–1˙5Sb–xCu solder joints

By Lee H. T.   Huang W. Y.   Chen Y. F.  

Science and Technology of Welding & Joining, Vol. 13, Iss. 8, 2008-11 ,pp. : 781-790

Maney Publishing

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Influence of Reflow and Thermal Aging on the Shear Strength and Fracture Behavior of Sn-3.5Ag Solder/Cu Joints

By Deng X.   Sidhu R.S.   Johnson P.   Chawla N.  

Metallurgical and Materials Transactions A, Vol. 36, Iss. 1, 2005-01 ,pp. : 55-64

Springer Publishing Company

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Understanding the effects of addition of copper nanoparticles to Sn-3.5 Ag solder

By Nadia Aemi   Haseeb A.S.M.A.  

Soldering & Surface Mount Technology, Vol. 23, Iss. 2, 2011-04 ,pp. : 68-74

Emerald Group Publishing Ltd

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Thermal fatigue endurance of Sn3Ag0.5Cu0.5In0.05Ni and Sn2.5Ag0.8Cu0.5Sb solders in composite solder joints of LTCC/PWB assemblies

By Nousiainen O.   Kangasvieri T.   Rautioaho R.   Vähäkangas J.  

Soldering & Surface Mount Technology, Vol. 23, Iss. 1, 2011-02 ,pp. : 30-39

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The effect of Pb contamination on the microstructure and mechanical properties of SnAg/Cu and SnSb/Cu solder joints in SMT

By Zhu Qinong   Sheng Mei   Luo Le  

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