A comparison of the quality of lead-free solder pastes

By Sitek Janusz   Rocak Dubravka   Bukat Krystyna   Fajfar-Plut Janeta   Belavic Darko  

Soldering & Surface Mount Technology, Vol. 16, Iss. 3, 2004-12 ,pp. : 22-30

Emerald Group Publishing Ltd

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Effect of PCB surface finish on creep properties of lead-free solder joints

By Sundelin Janne J   Nurmi Sami T   Lepistö Toivo K   Ristolainen Eero O  

Soldering & Surface Mount Technology, Vol. 17, Iss. 4, 2005-04 ,pp. : 3-9

Emerald Group Publishing Ltd

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Creep behaviour of composite lead-free electronic solder joints

By Guo F   Lee J   Subramanian K.N.  

Soldering & Surface Mount Technology, Vol. 15, Iss. 1, 2003-02 ,pp. : 39-42

Emerald Group Publishing Ltd

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Research Summary: The Creep Properties of Lead-Free Solder Joints

By Song H.G   Morris J.W.   Hua F.  

JOM, Vol. 54, Iss. 6, 2002-06 ,pp. : 30-32

Springer Publishing Company

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A high-performance lead-free solder - the effects of In on 99.3Sn/0.7Cu

By Hwang Jennie S   Guo Zhenfeng   Koenigsmann Holger  

Soldering & Surface Mount Technology, Vol. 13, Iss. 2, 2001-04 ,pp. : 7-13

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