Effect of PCB surface finish on creep properties of lead-free solder joints

By Sundelin Janne J   Nurmi Sami T   Lepistö Toivo K   Ristolainen Eero O  

Soldering & Surface Mount Technology, Vol. 17, Iss. 4, 2005-04 ,pp. : 3-9

Emerald Group Publishing Ltd

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Research Summary: Aspects of the Structural Evolution of Lead-Free Solder Joints

By Zribi A.   Kinyanjui R.   Borgesen P.   Zavalij L.   Cotts E.J.  

JOM, Vol. 54, Iss. 6, 2002-06 ,pp. : 38-40

Springer Publishing Company

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Creep behaviour of composite lead-free electronic solder joints

By Guo F   Lee J   Subramanian K.N.  

Soldering & Surface Mount Technology, Vol. 15, Iss. 1, 2003-02 ,pp. : 39-42

Emerald Group Publishing Ltd

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The effect of PCB surface finish on lead-free solder joints

By Nurmi Sami T   Sundelin Janne J   Ristolainen Eero O   Lepistö Toivo K  

Soldering & Surface Mount Technology, Vol. 17, Iss. 1, 2005-01 ,pp. : 13-23

Emerald Group Publishing Ltd

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Thermal cycling reliability of lead-free chip resistor solder joints

By Suhling Jeffrey C.   Gale H.S.   Johnson R. Wayne   Islam M. Nokibul   Shete Tushar   Lall Pradeep   Bozack Michael J.   Evans John L.   Seto Ping   Gupta Tarun   Thompson James R.  

Soldering & Surface Mount Technology, Vol. 16, Iss. 2, 2004-08 ,pp. : 77-87

Emerald Group Publishing Ltd

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