Author： Li Jue Xu Hongbo Hokka Jussi Mattila Toni T. Chen Hongtao Paulasto-Kröckel Mervi
Publisher： Emerald Group Publishing Ltd
ISSN： 0954-0911
Source： Soldering & Surface Mount Technology, Vol.23, Iss.3, 2011-06, pp. : 161-167
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
By Zeng Guang Xue Songbai Zhang Liang Sheng Zhong Gao Lili
Soldering & Surface Mount Technology, Vol. 22, Iss. 4, 2010-09 ,pp. :
Access to resources
Recommend
Reflow profile study of the Sn-Ag-Cu solder
By Salam B Virseda C Da H Ekere N.N. Durairaj R
Soldering & Surface Mount Technology, Vol. 16, Iss. 1, 2004-02 ,pp. :
Experiments on the aging of Sn–Ag–Cu solder alloys
By Snugovsky L. Perovic D. D. Rutter J. W.
Powder Metallurgy, Vol. 48, Iss. 2, 2005-06 ,pp. :