Silver nanoparticles effect on the wettability of Sn-Ag-Cu solder pastes and solder joints microstructure on copper

Author： Bukat K.   Koscielski M.   Sitek J.   Jakubowska M.   Mlozniak A.  

Publisher： Emerald Group Publishing Ltd

ISSN： 0954-0911

Source： Soldering & Surface Mount Technology, Vol.23, Iss.3, 2011-06, pp. : 150-160

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