Tensile strength of fine pitch QFP lead-free soldered joints with diode laser soldering

Author: Xue Peng   Xue Song-bai   Zhang Liang   Shen Yi-fu   Gao Li-li   Yu Sheng-lin   Zhu Hong   Han Zongjie   Chen Yan  

Publisher: Emerald Group Publishing Ltd

ISSN: 0954-0911

Source: Soldering & Surface Mount Technology, Vol.23, Iss.3, 2011-06, pp. : 177-183

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Abstract