Interfacial microstructure, shear strength and electrical conductivity of Sn–3˙5Ag–0˙5In/Cu lead free soldered joints

Author： Kar A.   Ghosh M.   Majumdar B. S.   Ghosh R. N.   Ray A. K.  

Publisher： Maney Publishing

ISSN： 1066-7857

Source： Materials Technology: Advanced Performance Materials, Vol.22, Iss.3, 2007-09, pp. : 161-165

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