The effect of Pb contamination on the microstructure and mechanical properties of SnAg/Cu and SnSb/Cu solder joints in SMT

By Zhu Qinong   Sheng Mei   Luo Le  

Soldering & Surface Mount Technology, Vol. 12, Iss. 3, 2000-12 ,pp. : 19-24

Emerald Group Publishing Ltd

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Interfacial microstructure, shear strength and electrical conductivity of Sn–3˙5Ag–0˙5In/Cu lead free soldered joints

By Kar A.   Ghosh M.   Majumdar B. S.   Ghosh R. N.   Ray A. K.  

Materials Technology: Advanced Performance Materials, Vol. 22, Iss. 3, 2007-09 ,pp. : 161-165

Maney Publishing

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Silver nanoparticles effect on the wettability of Sn-Ag-Cu solder pastes and solder joints microstructure on copper

By Bukat K.   Koscielski M.   Sitek J.   Jakubowska M.   Mlozniak A.  

Soldering & Surface Mount Technology, Vol. 23, Iss. 3, 2011-06 ,pp. : 150-160

Emerald Group Publishing Ltd

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Effect of Ag content on the microstructure of Sn-Ag-Cu based solder alloys

By Reid M.   Punch J.   Collins M.   Ryan C.  

Soldering & Surface Mount Technology, Vol. 20, Iss. 4, 2008-09 ,pp. : 3-8

Emerald Group Publishing Ltd

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The effects of additives to SnAgCu alloys on microstructure and drop impact reliability of solder joints

By Liu Weiping   Lee Ning-Cheng  

JOM, Vol. 59, Iss. 7, 2007-07 ,pp. : 26-31

Springer Publishing Company

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