Al surface morphology effect on flip-chip solder bump shear strength

By Wai Ching Yau E.   Feng Gong J.   Chan P.  

Microelectronics Reliability, Vol. 44, Iss. 2, 2004-02 ,pp. : 323-331

Elsevier

Access to resources Recommend Favorite

Impact Testing of Sn-3.0Ag-0.5Cu Solder with Ti/Ni(V)/Cu Under Bump Metallization After Aging at 150°C

By Wang Kai-Jheng  

Journal of Electronic Materials, Vol. 39, Iss. 12, 2010-12 ,pp. : 2558-2563

Springer Publishing Company

Access to resources Recommend Favorite

Suppressing Sn-Patch Growth in Ti/Ni(V)/Cu Under Bump Metallization with Sn-Ag-Cu Solder After Reflow and Aging

By Wang Kai-Jheng  

Journal of Electronic Materials, Vol. 41, Iss. 4, 2012-04 ,pp. : 757-762

Springer Publishing Company

Access to resources Recommend Favorite

Transmission Electron Microscopy Characterization of Ni(V) Metallization Stressed Under High Current Density in Flip Chip Solder Joints

By Tsai M.  

Journal of Electronic Materials, Vol. 39, Iss. 12, 2010-12 ,pp. : 2528-2535

Springer Publishing Company

Access to resources Recommend Favorite

Assembly and reliability of flip chip on boards using ACAs or eutectic solder with underfill

By Zhong Zhaowei  

Microelectronics International, Vol. 16, Iss. 3, 1999-12 ,pp. : 6-14

Emerald Group Publishing Ltd

Access to resources Recommend Favorite