Effect of voids on the reliability of BGA/CSP solder joints

By Yunus M.   Srihari K.   Pitarresi J.M.   Primavera A.  

Microelectronics Reliability, Vol. 43, Iss. 12, 2003-12 ,pp. : 2077-2086

Elsevier

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The effect of small additions of copper on the aging kinetics of the intermetallic layer and intermetallic particles of eutectic tin-silver solder joints

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A review on effect of minor alloying elements on thermal cycling and drop impact reliability of low-Ag Sn-Ag-Cu solder joints

By Shnawah Dhafer Abdul Ameer   Sabri Mohd Faizul Bin Mohd   Badruddin Irfan Anjum   Said Suhana  

Microelectronics International, Vol. 29, Iss. 1, 2012-01 ,pp. : 47-57

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Influence of Dopant on Growth of Intermetallic Layers in Sn-Ag-Cu Solder Joints

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High-Temperature Resistant Intermetallic Compound Joints for Si Chips and Cu Substrates

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