A new concept for the use of Al-sheet as integrated substrate for one or multichip module package

By Philippov Ph.   Arnaudov R   Yordanov N   Gospodinova M  

Microelectronics International, Vol. 15, Iss. 3, 1998-03 ,pp. : 36-41

Emerald Group Publishing Ltd

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Embedded passive components and PCB size - thermal effects

By Stubbs D.M.   Pulko S.H.   Wilkinson A.J.   Wilson B   Christiaens F   Allaert K  

Microelectronics International, Vol. 17, Iss. 2, 2000-02 ,pp. : 7-10

Emerald Group Publishing Ltd

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Studying electro-physical material characteristics of vacuum-deposited layers of aluminium (tantalum) when using aluminium sheet as a carrier for MCM, interconnections, vias and resistive groups

By Philippov Ph.   Arnaudov R   Yordanov N   Ianev V   Gospodinova M  

Microelectronics International, Vol. 15, Iss. 3, 1998-03 ,pp. : 31-35

Emerald Group Publishing Ltd

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Low resistive Au-free, Ta-based, recessed ohmic contacts to InAlN/AlN/GaN heterostructures

By Bergsten J   Malmros A   Tordjman M   Gamarra P   Lacam C   Forte-Poisson M-A di   Rorsman N  

Semiconductor Science and Technology, Vol. 30, Iss. 10, 2015-10 ,pp. : 105034-105040

IOP Publishing

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Effective optimization of integrated circuits with embedded passive modules by applying semisymbolic LCS AC analysis method

By Balik Franciszek  

Microelectronics International, Vol. 28, Iss. 3, 2011-08 ,pp. : 36-42

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