![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
Author: Zhang S. Baets J. De Calster A. Van
Publisher: Emerald Group Publishing Ltd
ISSN: 1356-5362
Source: Microelectronics International, Vol.16, Iss.3, 1999-12, pp. : 39-42
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
Assembly issues in three flip chip processes
Microelectronics International, Vol. 17, Iss. 2, 2000-02 ,pp. :
![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
Flip chip assemblies using gold bumps and adhesive
Microelectronics International, Vol. 18, Iss. 3, 2001-12 ,pp. :