Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology

Author： Kar Yap Boon Talik Noor Azrina Sauli Zaliman Seng Foong Chee Yong Tan Chou Retnasamy Vithyacharan

ISSN： 1356-5362

Source： Microelectronics International, Vol.30, Iss.2, 2013-04, pp. : 99-103

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