Optimization of fins used in electronic packaging

Author: Ong Kang Eu   Lee Kor Oon   Seetharamu K.N.   Azid I.A.   Quadir G.A.   Zainal Z.A.   Goh Teck Joo  

Publisher: Emerald Group Publishing Ltd

ISSN: 1356-5362

Source: Microelectronics International, Vol.22, Iss.1, 2005-04, pp. : 10-15

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Abstract